| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit pattern converting subprinted board wherein mismatching of a circuit wiring which is generated relative to the connection between an electronic circuit board and a mounted IC is easily corrected, and correction to a surface mount type flat package IC having different terminal arrangement is also easily enabled. SOLUTION: A subprinted board 11 is used in order to mediate electrical connection between connection pads 13a of an electronic circuit board 13 for surface mounting and connection leads 12a of a flat package IC 12 for surface mounting which is mounted on the board. A circuit pattern which connects the pads 13a and the leads 12a in a specified relation, in order to convert an initial circuit pattern built in the electronic circuit board 13, is formed in the subprinted board 11. |
