| 摘要 |
Data medium card consisting of a card body (1) which comprises a first plastics material having a recess (10) with a ledge (11) on which a carrier film (2) which comprises a second plastics material and carries a circuit module (20) is sealed by means of a hot-melt adhesive film (3), the hot-melt adhesive film (3) comprising two part adhesive films (3A, 3B) bonded together over their entire surfaces, of which the first part adhesive film (3A) has an optimum adhesion to the first plastics material of the card body (1) and the second part adhesive film (3B) has an optimum adhesion to the second plastics material of the carrier film (2). <IMAGE> |
