| 摘要 |
<p>An injection molding apparatus and a method of encapsulating integrated circuits which include a plurality of molding presses, such as transfer molding presses for encapsulating integrated circuits, which are mounted on an indexable rotary table. Stationary loading and unloading stations are arranged at spaced angular locations around the table for loading an insert into the mold cavities. A controller is provided to rotate with the molding presses for individually controlling function thereof such as opening and closing of the presses and temperature and pressure in the molds.</p> |
