发明名称 Hot melt adhesive system for easily removed wrap-round label
摘要 - Hot melt adhesive system for sticking wrap-round labels to an article consists of a pick-up adhesive and overlap adhesive. The novelty is that the pick-up adhesive has high enough adhesion for labelling at its application temp. and practically no adhesion to the article or label in the set state. Also claimed are methods of applying easily-removed labels with this system and for removing the labels.
申请公布号 DE19618549(A1) 申请公布日期 1997.11.13
申请号 DE19961018549 申请日期 1996.05.09
申请人 HENKEL KGAA, 40589 DUESSELDORF, DE 发明人 HEEMANN, MARCUS, 40225 DUESSELDORF, DE;KLINGBERG, WOLFGANG, 41352 KORSCHENBROICH, DE;PUERKNER, ECKHARD, DR., 40595 DUESSELDORF, DE;AURIS, JAN-DIRK, 41539 DORMAGEN, DE
分类号 B65C9/20;C09J7/04;C09J123/02;(IPC1-7):C09J9/00 主分类号 B65C9/20
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