CHIP CARD MODULE WITH CONDUCTIVE PLASTIC COATING AND PROCESS FOR MANUFACTURING THE SAME

摘要

A chip card module has a carrier (1), a semiconductor chip (7) and a top side (10) with a plurality of contact surfaces (2) in conductive connection (8) with the semiconductor chip (7). The top side (10) is coated at least in the area of the contact surfaces (2) with an electroconductive plastic material (6). Also disclosed is a process for producing such chip card modules. The disclosed chip card modules are simple and economic to produce and have a remarkable wear resistance and high corrosion resistance.