Herstellung elektronischer Bauelemente mit Hilfe von Leiterrahmen

摘要

A lead frame (10) includes an outside frame portion having a central opening (14) and a rectangular mount portion (16) supported by the outside frame portion and disposed within the central opening, and on which an electronic element is adapted to be mounted. The lead frame also includes at least one lead element array (221,...224) disposed along a side of the mount portion, the lead elements included in the array being connected to each other by a common tie bar element (24), and two expandable tie bar elements (26) extending between the outside frame portion and each of the lead element arrays to support each lead element array from the outside frame portion, each of the expandable tie bar elements including a portion shaped so that it can be expanded by a deformation thereof. In a method of producing an electronic component using the lead frame, a process of bending the lead elements is performed before an electrolytic plating process thereof, thereby facilitating production of a uniform plated layer.