Leiterverbundsystem und Verfahren zur Herstellung elektrisch leitender Verbindungen zwischen zwei oder mehr Leiterstrukturen

摘要

This invention concerns a process for establishing at least one electrically conducting connection between two or more conductor structures (2, 4), of which at least one is connected to a carrier (3) to form a conductor compound system. At least one of the conductor compound systems has openings (6) at the points of contact of the conductor structure in the region of which the connection is established by supplying thermal energy or by introducing an electrically conducting material. The invention makes it possible to establish electrically conducting connections between several conductor structures in a simple and cost-efficient manner and avoids damage even to temperature-sensitive thermoplastic carriers.