| 摘要 |
<p>A three-dimensional multi-layer moulded electronic device and method for manufacturing same, wherein the device comprises at least two moulded, three-dimensional substrates (12, 14) having mating surfaces (20, 22), each substrate including a layer (16, 18) of patterned conductive material on at least one surface and electrically conductive vias (24, 26) at selected locations of the substrate for interconnection of the conductive layers (16, 18), wherein the substrates (20, 22) are electrically joined at their mating surfaces and the circuit layers (16, 18) are aligned and interconnected to form a multi-layer, three-dimensional circuit which may include moulded-in structural features.</p> |
