| 发明名称 |
Substrate wafer wet treatment device |
| 摘要 |
The device has a container (1) holding a number of substrate wafers, supplied with a treatment fluid for the latter via a nozzle system with a number of nozzles (7), for providing a uniform laminar flow pattern within the container. The nozzles may have different spray angles (8,9) and are arranged in a matrix pattern across the base of the container, with some nozzles providing a fan-shaped spray while the others provide a conical spray.
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| 申请公布号 |
DE19654903(A1) |
申请公布日期 |
1997.11.13 |
| 申请号 |
DE1996154903 |
申请日期 |
1996.04.24 |
| 申请人 |
STEAG MICROTECH GMBH, 72124 PLIEZHAUSEN, DE |
发明人 |
WEBER, MARTIN, 72124 PLIEZHAUSEN, DE;OSHINOWO, JOHN, DR., 72124 PLIEZHAUSEN, DE |
| 分类号 |
B08B3/02;B01J19/26;B08B3/10;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):H01L21/302;C23G3/00;B01J19/00 |
主分类号 |
B08B3/02 |
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