MANUFACTURE SOLDER BUMP OF CHIP MOUNT

摘要

A solder bump manufacturing method for embedding a semiconductor chip is disclosed. In the solder bump manufacturing method comprising the steps of forming a burier metal on a metal pad of a semiconductor substrate, opening a predetermined portion via dry film coating/developing/printing process by using a photolithography method, forming a solder on the opened pad, and deleting a remained photoresist and forming a semi-sphered bump via a reflow process, the solder bump manufacturing method includes the steps of forming the burier metal by using non-electrolysis coating method and forming the solder bump with screen printing method by using the dry film. Thereby, the solder bump manufacturing method can be applied to all kinds of semiconductor chips having several sizes and heights.