| 摘要 |
An integrated circuit encapsulation apparatus comprises a molding press, which has a mold defining a cavity adapted to receive an integrated circuit die and an attached leadframe for encapsulation thereof. The molding press is operable by an electro-pneumatic driving mechanism which utilises a geared servo motor for opening and closing the mold, and a pneumatic cylinder for providing clamping pressure. Both the servo motor and pneumatic cylinder act upon a threaded screw member for movement of the molding press. The press is provided with an integrated mold brushing unit which has transversely rotating brushes and travels over the mold faces to remove debris. In a further refinement, a spring-loaded bearing system is provided for easy removal of the mold. |
