发明名称 Epitaxy on a substrate
摘要 <p>A substrate wafer for epitaxy of a compound semiconductor single crystal and an epitaxy using the substrate wafer are disclosed. Where the orientation off-angle from the <100> plane of an area available for device formation of a surface of the substrate wafer is theta <.>, and the growth rate on an epitaxial layer on the substrate wafer is V mu m/hr, and the growth temperature of the epitaxial layer is T K, the orientation off-angle theta <.> is given by the following expression: <MATH> where 0.1 </= V </= 10 and 853 </= T </= 1023. The substrate wafer is capable of significantly reducing the number of teardrop-like hillock defects which appear on the surface of the epitaxial layer and of increasing the smoothness of the surface of the epitaxial layer.</p>
申请公布号 EP0567329(B1) 申请公布日期 1997.11.12
申请号 EP19930303132 申请日期 1993.04.22
申请人 JAPAN ENERGY CORPORATION 发明人 NAKAMURA, MASAHI;KATSURA, SHIGEO;HIRANO, RYUICHI;MAKINO, NOBUHITO;IKEDA, EIJI
分类号 C30B25/16;C30B25/02;C30B25/18;C30B29/40;H01L21/20;H01L21/205;(IPC1-7):H01L21/20;C30B25/20 主分类号 C30B25/16
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