| 摘要 |
PROBLEM TO BE SOLVED: To improve an electronic part in bonding properties when the electronic part is wire-bonded to a Cu conductor which serves as a wiring pattern on a circuit board. SOLUTION: This mounting method is carried out through such a manner that a Cu conductor where an electronic part such as a semiconductor chip is wire-bonded is coated with a resin layer, and then the electronic part is soldered through a solder reflow process. Thereafter, the resin layer is separated off, and then the Cu conductor is wire-bonded to the electronic part. Therefore, the electronic part can be well wire-bonded to the Cu conductor keeping the Cu conductor clean. |
