发明名称 METHOD FOR RESIN SEAL MOLDING OF ELECTRONIC PART AND APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To prevent the formation of voids in the inner and outer parts of a resin sealed molded object molded in a mold cavity by efficiently and certainly sucking and discharging air, moisture and gases remaining in respective open air cutting-off ranges formed by cutting off at least the pots, resin passages and cavities in both of the upper and lower molds of a resin seal molding part from the open air. SOLUTION: The air remaining in the open air cutting-off range of a mold 21 is forcibly sucked and discharged by the evacuation action of a vacuum tank 63 held to a predetermined vacuum degree by the vacuum pump 62 for the mold provided in an evacuation mechanism 60 and the vacuum pump 64 from the vacuum tank to perform the resin seal molding of the electronic part on the lead frame fitted in and set to a mold cavity.
申请公布号 JPH09290443(A) 申请公布日期 1997.11.11
申请号 JP19960131012 申请日期 1996.04.26
申请人 TOWA KK 发明人 KAWAMOTO YOSHIHISA
分类号 B29C33/12;B29C45/02;B29C45/14;B29C45/34;B29L31/34;H01L21/56;(IPC1-7):B29C45/34 主分类号 B29C33/12
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