| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve strength and thermal conductivity by using a copper alloy material containing specific elements in specific weight ratio as a material for metallic substrate for semiconductor package. SOLUTION: A material for metallic substrate for plastic package in which semiconductor chips bonded to the metallic substrate are sealed with thermosetting resin is composed of a copper alloy excellent in thermal conductivity and strength, having a composition which consists of, by weight, 1-4.8% Ni, 0.2-1.4% Si, 0.001-2%, in total, of one or more elements among Mg, Zn, Sn, Fe, Ti, Zr, Cr, Al, Mn, and Be, and the balance Cu with inevitable impurities and in which the concentration ratio of Ni to Si is regulated to 2-8. By this method, the material for metallic substrate for semiconductor packaging can be produced.</p> |
