| 摘要 |
<p>PROBLEM TO BE SOLVED: To more effectively reduce the background noise, without deteriorating the heat radiation characteristic of a package for semiconductor device. SOLUTION: This package comprises an interconnection board 1 having element-mounting openings 2 around which laminate ceramic capacitors 7 are mounted, and a metal plate 4 fixed to this board to improve the heat radiation characteristic. This plate 4 locates away from the capacitor mounting area and extends up to the upper face of the interconnection board 1 outside this mounting area. Hence, if the capacitor mounting area is near a semiconductor element 9, it has no influence on the fixing area of the metal plate 4, never deteriorates the radiation characteristic and can effectively reduce the background noise.</p> |
