发明名称 |
Apparatus for cooling printed circuit boards in wave soldering |
摘要 |
An apparatus and method for soldering components to a circuit board. The apparatus includes a conveyor in a tunnel for transporting the board through a preheat zone, molten waves of solder including a turbulent wave and a laminar wave, and a cool down zone through which the board passes upon exit from the laminar flow wave of the solder wave. The improvement comprises at least one distributing manifold mounted in the tunnel having an inlet port for receiving a cold gas under pressure and at least one outlet nozzle for directing the cold gas to the circuit board, thereby rapidly cooling the circuit board and the components.
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申请公布号 |
US5685475(A) |
申请公布日期 |
1997.11.11 |
申请号 |
US19950524662 |
申请日期 |
1995.09.08 |
申请人 |
FORD MOTOR COMPANY |
发明人 |
JAIRAZBHOY, VIVEK AMIR;GLOVATSKY, ANDREW Z.;YERDON, TIMOTHY JOSEPH |
分类号 |
B23K31/02;B23K1/08;B23K3/06;B23K3/08;H05K3/34;(IPC1-7):B23K3/00 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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