| 摘要 |
PROBLEM TO BE SOLVED: To improve a hybrid integrated circuit package in noise.cross talk characteristics by a method wherein a signal line required to be protected against noise.cross talk is provided in three dimensions separate and isolated from other lines. SOLUTION: A signal line required to be protected against noise.cross talk is so laid as to be connected to a signal line outer connection terminal 4 provided in the upside of a package where a semiconductor IC chip 3 mounted on a wiring board 2 is housed, and other lines which are not required to be protected against noise.cross talk are laid so as to be connected to an outer connection terminal 5 provided in the base of the package. By this setup, the signal line can be laid in three dimensions, so that a hybrid integrated circuit package of this constitution can be improved in noise.cross talk characteristics. |
