FORMING METHOD OF CONNECTING STRUCTURE BODY

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a connecting structure body at a low cost. SOLUTION: When a lead array is connected to the conductive connecting pad of an integrated circuit element taking advantage of a tape automated bonding method and also using composite bumps and an anisotropic conductive film. Conductive particles 31 are inserted between the leads 22 of a lead array (on a dielectric layer 23) and a conductive metal film 46 of composite bumps formed on an integrated circuit element 20. The composite bumps contain a polymer body 47 coated with the conductive metal film 46 and are formed on bonding pads 48. A connecting process is carried out at a low temperature under a low pressure, and a joint is automatically sealed up when it is finished, so that a connecting structure body of this constitution is lessened in cost and improved in dimensional stability. Automated sealing enhances the connecting structure body in reliability.