发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To decide a replacing period of a polishing pad in accordance with its wearing condition, by deciding the replacing period of the polishing pad from its height when it is controlled so as to fix a pressure applied to the polishing pad. SOLUTION: In a device controlling computer 8, a polishing pad replacement indicating part 10 and a threshold value setting part 11 are provided, by these parts, a polishing pad replacement indicating means is constituted. In the threshold setting part 11, a threshold value of polishing pad height and/or polishing pad pressure for deciding replacement timing of a polishing pad is input and stored. In the polishing pad replacement indicating part 10, a threshold value stored in the threshold value setting part 11 is compared with a measured value measured by a polishing pad pressure measuring means 6 or polishing pad height measuring means 7, whether the polishing pad is in a replacement period or not is decided, indication is output.
申请公布号 JPH09290363(A) 申请公布日期 1997.11.11
申请号 JP19960106656 申请日期 1996.04.26
申请人 SUMITOMO METAL IND LTD 发明人 HASEGAWA KAZUTO;FUJITA TAKASHI
分类号 B24B37/04;B24B37/20;B24B37/24;H01L21/304 主分类号 B24B37/04
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