发明名称 |
Semiconductor device having integral structure of case and external connection terminals |
摘要 |
It is an object of the present invention to obtain a power semiconductor device with small size and high reliability in power semiconductor devices having integral structure of case and external connection terminals. A dummy pad (42) having no electric connection with other parts is provided and a terminal end of a connecting wire (46) connecting by sequentially bonding an exposed surface of a connection electrode (43) and a bonding pad (41) of a semiconductor element (40) is bonded thereto. The semiconductor device can be miniaturized without deteriorating electric characteristics and reliability of the semiconductor elements.
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申请公布号 |
US5686758(A) |
申请公布日期 |
1997.11.11 |
申请号 |
US19950441738 |
申请日期 |
1995.05.16 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
ARAI, KIYOSHI;TAKAGI, YOSHIO;IWASA, TATSUYA |
分类号 |
H01L25/07;H01L25/18;(IPC1-7):H01L25/07;H01L23/12 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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