Cleaning apparatus

摘要

A cleaning apparatus includes a spin chuck for holding and rotating a wafer, a brush for rubbing the surface of the wafer, and an arm for supporting the brush. A support is coupled to the arm through a linear guide. The arm and the support moves together in a horizontal direction and can relatively displace in a vertical direction. A compression spring is arranged between the arm and the support and deformed in accordance with a relative displacement of the arm and the support in the vertical direction. When the brush contacts the wafer held by the spin chuck, a biasing force of the brush against the wafer is generated in correspondence with deformation of the compression spring. The biasing force of the brush is set by adjusting the downward moving amount of the support in the vertical direction.