发明名称 |
TRAY FOR INTEGRATED CIRCUITS |
摘要 |
<p>A tray for integrated circuits which is made from a thermoplastic resin composition comprising 100 parts by weight of a polyphenylene ether resin, 0.1 to 40 parts by weight of carbon fibers having a number-average fiber length in the range of 0.05 to 1.5 mm, and 0.1 to 50 parts by weight of a flaky inorganic filler having an aspect ratio of 20 or above, and which has a surface resistivity in the range of 10<1> to 10<1><2> OMEGA . This tray is excellent in conductivity and heat resistance and reduced in warpage.</p> |
申请公布号 |
KR0121749(B1) |
申请公布日期 |
1997.11.11 |
申请号 |
KR19937001955 |
申请日期 |
1993.06.25 |
申请人 |
MITSUI TOATSU CHEMICALS KK. |
发明人 |
UEKI, TORU;YOSHIMURA, MASAJI;KANEZAKI, KAZUHARU;IWATA, INEO;TAKIGUCHI, MINORU |
分类号 |
B65D85/00;B65D85/38;B65D85/86;C08J5/00;C08K3/34;C08K7/00;C08K7/06;C08K7/10;C08L71/12;H01L21/60;H01L21/673;H01L21/68;H05K13/00;(IPC1-7):H01L21/68 |
主分类号 |
B65D85/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|