发明名称 COMPACT ELECTRONIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To make feasible of thinning and light weighting of a solid electronic device. SOLUTION: A substrate 3 mounted with an electronic component contained in a case body composed of a pair of plastic made outer shells 1, 2, divided into outside and inside. The honeycomb cores 4 are integrally molded of plastic in the parts away from the electronic component 13 on the inner surface of the outer shells 1, 2. Besides, recessions 5 encircled by stepped parts in the shape corresponding to the outer periphery of the honeycomb cores 4 are provided on the outside and inside of the substrate 3. In such a constitution, the outer shells 1, 2 are joined together with the front ends of respectively provided honeycomb cores 4 engaged with the recessions 5.</p>
申请公布号 JPH09293972(A) 申请公布日期 1997.11.11
申请号 JP19960102615 申请日期 1996.04.24
申请人 NEC CORP 发明人 YOSHINO RIEKA
分类号 H05K5/00;G06F1/16;(IPC1-7):H05K5/00 主分类号 H05K5/00
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