| 摘要 |
<p>PROBLEM TO BE SOLVED: To surely prevent a cutting failure from occurring continuously in a dicing device by a method wherein the surface of a semiconductor wafer subjected to a cutting process and relatively transferred by an X-Y-θdrive stage is imaged by an imaging means, image signals are outputted from the imaging means, and the state of the split semiconductor wafer is checked from the image signals. SOLUTION: A semiconductor wafer 2 is transferred to a loading/unloading wafer standby station 14 located properly distant from a loading/unloading station 3 in the direction of a Y axis from the station 13, and then the wafer 2 is transferred to an alignment station 6 on an X-Y-θdrive stage 10'. An image sensing camera 18 is arranged above the alignment station 6, the surface of the semiconductor wafer 2 is imaged by the image sensing camera 18, image signals outputted from the image sensing camera 18 are inputted into a picture image processing section, the alignment state of the semiconductor wafer 2 is judged by the picture image processing section, and it is checked in a visual inspection process whether a semiconductor chip is defective or not. By this setup, a semiconductor wafer 2 can be surely protected against cutting failures which occur in succession.</p> |
