| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of power source pins, increase the number of semiconductor signal pins, and reduce the size and cost of a semiconductor package. SOLUTION: A metal lead frame for use in assembling of a semiconductor device has a lead frame 101 for VDD power source only and a semiconductor supporting lead frame 102 also used for a VSS power source. A semiconductor device 103 is adhered to an insulation adhesive to the latter lead frame 102. The former lead frame 101 is located vertically above an electric signal transmitting lead frame 108 and formed as a ring surrounding the periphery of the semiconductor device 103. Owing to this structure, any semiconductor pad can be connected through a binding wire to the power-only lead frame. |
