发明名称 ELECTRONIC-PART-TAPING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To prevent an electronic part from being dropped or displaced as by an external force and maintain initial dimensional accuracy, by applying an adhesive in advance to the entire periphery of a lead in an area where a taping paper-mount and adhesive tape are stuck together, and by bonding it thereto by the application of pressure. SOLUTION: The entire periphery of a lead 2 in an area where a taping paper-mount 5 and adhesive tape 4 are stuck together is covered with adhesive tape 4 used for applying an adhesive 3 in advance by a method such as spraying or coating, and it is bonded thereto by exerting pressure by means of a roller or trowel. Thus, because the application of the adhesive 3 to the entire periphery of the lead 2 in the sticking area makes the area where the lead 2 is stuck to the taping paper-mount 5 and adhesive tape 4 larger than a vertical sticking area, an electronic part 1 is prevented from being dropped or displaced as by an external force, and initial dimensional accuracy can be maintained.
申请公布号 JPH09290889(A) 申请公布日期 1997.11.11
申请号 JP19960105253 申请日期 1996.04.25
申请人 NEC YAMAGATA LTD 发明人 TAKAHASHI TAKAKI
分类号 B65D73/02;B65B15/04;B65D85/86;H05K13/02 主分类号 B65D73/02
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