| 摘要 |
<p>PROBLEM TO BE SOLVED: To align a large number of semiconductor chips making it face upwards with an alignment jig at a time by a method wherein the upside of a flat semiconductor chip is cut along its edges so as to make the semiconductor chip provided with a projection with vertical sides. SOLUTION: A semiconductor wafer 12 bonded onto an adhesive tape 13 is placed on an X-Y table 16 and fixed by vacuum-suction through suction holes 17. Then, a dicing blade 15 rotating at a high speed is brought into contact with the semiconductor wafer 12 to cut it so deep as to reach to the adhesive tape 13. At this point, the outer circumference of the dicing blade 15 is so formed as to change in thickness from W toωby stages, so that the upside of the semiconductor chip 2 is cut along its edges to make the chip provided with a projection 3 with a step K like a bump. By this setup, a large number of semiconductor chips can be aligned facing upwards with an alignment jig at a time.</p> |
