MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

Disclosed is a forming method of a fine pattern which can decrease a step coverage between patterns. At the time of forming a first conductive pattern(3) having step coverage and used for driving of device, a dummy patterns(3b) not used for driving of device are substantially formed by same width and distance with the first conductive pattern(3). Thereby it is possible to increase a reliability and an yield of semiconductor devices by reducing a step coverage.