Installierungsstruktur für Bauteile und Verfahren zur Herstellung einer Installierungsstruktur für Bauteile

摘要

A present invention is to provide a thin parts installation structure and their manufacturing method. This is formed a circuit (11) on the wiring substrate (1), the adhesive (3) is deposited on the part installation scheduled position of the said wiring substrate (1), the conductive adhesive (4) is deposited on the terminal areas of the wiring pattern circuits, the electronic part (2) is put on the scheduled part of wiring substrate (1) and touching the terminals (21) of the electronic part (2) to said conductive adhesive (4) while not making these adhesive (3) and conductive adhesive (4) solid, then said adhesive (3) and conductive adhesive (4) are stiffened.