| 摘要 |
<p>A bridge (15) is used to mount a heat generating electronic component (11) such as an RF power amplifier to a heat sink plate or the like. The bridge is made of heat conductive material to assist in dissipating heat away from the power amplifier while providing an electromagnetic border between input and output sides of the amplifier. Also, a simplified method of mounting the transistor to the underlying material (13) is disclosed.</p> |
