Packung hoher Dichte für mehrere entfernbare elektronische Baugruppen

摘要

Packaging for an electronics assembly. A base card (200) has a row of elongated slots (221). A number of individually insertable subassemblies (300) have standoff feet and a pair of offset hooks at their sides. The hooks snap into the slots in such a way that each slot can hold the hooks for four different subassemblies, which are positioned adjacent each other and on both sides of the base card.