发明名称 Removing metal impurities from silicon metalloid surface
摘要 Process for removing metal impurities from the surface of a silicon metalloid comprises: (a) contacting the metalloid with vapour phase hydrofluoric acid at 15-100 deg C; and (b) contacting the metalloid with an aqueous solution containing /2 wt.% H2O2. Also claimed is a process for analysing silicon on metal surface impurities comprising: (A) carrying out the removal process as above; and (B) analysing the aqueous phase to determine the metal concentration by graphite furnace atomic absorption, inductively coupled plasma mass spectrometry, and ion chromatography.
申请公布号 DE19718401(A1) 申请公布日期 1997.11.06
申请号 DE1997118401 申请日期 1997.04.30
申请人 HEMLOCK SEMICONDUCTOR CORP., HEMLOCK, MICH., US 发明人 HWANG, LYDIA LEE-YORK, MICHIGAN, US;PORSCHE, ARTHUR FRANCIS, MICHIGAN, US
分类号 G01N21/73;C22B15/00;C23F1/18;C30B29/06;C30B33/10;C30B33/12;G01N21/74;G01N30/00;G01N30/02;G01N30/04;H01L21/02;H01L21/304;H01L21/306;(IPC1-7):C23F1/12;G01N30/96 主分类号 G01N21/73
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