HARZIMPRAEGNIERTES LAMINAT ZUR ANWENDUNG IN LEITERPLATTEN
摘要
Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per DEG C, a basis weight of from 0.8 to 4.0 oz/yd2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec.
申请公布号
DE69402538(T2)
申请公布日期
1997.11.06
申请号
DE1994602538T
申请日期
1994.03.28
申请人
E.I. DU PONT DE NEMOURS AND CO., WILMINGTON, DEL., US
发明人
KIRAYOGLU, BIROL, WILMINGTON, DE 19803, US;SULLIVAN, WILLIAM, JOHN, RICHMOND, VA 23235-1313, US;ZUSSMAN, MELVIN, PAUL, WILMINGTON, DE 19810, US
