发明名称 Ein Weichlot mit verbesserten mechanischen Eigenschaften, enthaltendes Gegenstand und Verfahren zur Herstellung dieses Weichlot
摘要 New solder compositions which can have improved mechanical properties are disclosed. In a preferred embodiment, the solder comprises a matrix material and magnetically dispersed particles. A desirable dispersion of the magnetic particles in the matrix material, is accomplished by applying a magnetic field to the molten matrix material containing magnetic particles and solidifying it in the presence of the magnetic field. The particle-dispersed microstructures improve the mechanical properties of the solder composition. The improved solder composition can be made into a powder to be used in solder paste, cream or reshaped while substantially retaining the improved mechanical properties.
申请公布号 DE69402895(T2) 申请公布日期 1997.11.06
申请号 DE1994602895T 申请日期 1994.02.09
申请人 AT & T CORP., NEW YORK, N.Y., US 发明人 JIN, SUNGHO, MILLINGTON, NEW JERSEY 07946, US;MCCORMACK, MARK THOMAS, SUMMIT, NEW JERSEY 07901, US
分类号 B22F1/02;B23K1/00;B23K35/02;B23K35/14;B23K35/24;B23K35/26;B23K35/40;C22C1/10;H01R43/02;H05K3/34;(IPC1-7):B23K35/14 主分类号 B22F1/02
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