发明名称
摘要 In a multilayered integrated memory circuit, a method using an insulating "sticks" is disclosed to provide a contact between two layers or regions, or one of each, where the contact does not short to an intervening conductive layer. This invention provides this with minimal extra processing by using sacrificial layers with appropriate etch and etch stop properties. As these layers are etched, additional layers which alternate in the same conducting/insulating pattern are exposed. Each etch stops on either a conductive or insulative layer. A contact layer may then be deposited which connects the uppermost capacitor plate to the pass transistor of the memory cell. <IMAGE>
申请公布号 JP2673615(B2) 申请公布日期 1997.11.05
申请号 JP19910212930 申请日期 1991.07.30
申请人 发明人
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108;H01L29/92 主分类号 H01L27/04
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