Semiconductor module

摘要

The starting point in the production of a power semiconductor module is a ceramic baseplate (10) on which copper sheets and copper conductor tracks (2, 3, 20, 20', 22, 22') are mounted with the aid of a suitable method. The ceramic baseplate (10) is then scribed and broken. This produces ceramic side plates (11, 11', 12, 12') which are connected to the baseplate 10 via conductor tracks (20, 21, 22, 23). The side plates (11, 12, 11', 12') are then folded up, as a result of which the conductor tracks (22, 22') mounted on the side plates (11, 12, 11', 12') are moved into a plane above the base plane. As a result of suitable, possibly multiple breaking and folding of the side plates (11, 12, 11', 12') and suitable forming of the ends (25, 25') of the conductor tracks (22, 22'), direct connection can be made to the connection terminals of the power semiconductor chips (4, 4'). Electronic circuits (30) can be provided on the side plates (11, 11').