| 摘要 |
An electromagnetic probe (308, 400, 502, 614, 702) is integrated within an integrated circuit (300) or mounted within an IC package to provide a capability for testing continuity between the integrated circuit (300, 600) and a substrate (312) to which the integrated circuit is mounted. In a first embodiment, capacitive test probes (308) are integrated within the integrated circuit (300), underneath bonding pads. In a second embodiment, Hall-effect devices (400) are integrated within the integrated circuit underneath bonding pads (408). In a third embodiment, an inductive loop (502) is integrated within the integrated circuit underneath bonding pads (500). In a fourth embodiment, an IC package assembly includes an internal capacitive test probe (614) for electrical continuity testing. An internal shield (610) may also be used as a capacitive test probe. In a fifth embodiment, an IC package assembly includes an inductive loop (702) within the package for electrical continuity testing. The integrated or intrapackage test probes provide electromagnetic coupling to bonding pads or to a lead frame and to bonding wires (if present), to detect whether there is electrical continuity between an integrated circuit bonding pad or lead frame and conductors (310) on an external substrate (312). The integrated or intrapackage test probes enable continuity testing for direct-bonding with no package, or for a package assembly even if the package assembly includes grounded shielding or a grounded heat sink. <IMAGE> |
