| 摘要 |
PROBLEM TO BE SOLVED: To easily produce elements, without giving a heat history to an org. thin film by forming an A1 thin film beneath electrodes composed of an Al thin film contacted with the org. thin film and bonding lead wires to outside exposed parts of this Al film. SOLUTION: On a substrate 1 electrodes 2 are formed, at least the upper layer of which is covered with a precious metal thin film and an org. thin film 3 to be a sensing part is formed thereon. An Al thin film 5 is formed between the electrodes 2 and substrate 1 and has a pattern different from at least a part of the pattern of the electrodes 5 and the surface thereof is partly exposed to outside. Lead wires 4 are bonded to the exposed parts 5a. Thus it is possible to easily bond the lead wires, without raising the temp. of the Al tin film due to the ultrasonic bonding and hence easily produce elements, without giving a heat history to the org. thin film. |
