SUBSTRATE FOR SEMICONDUCTOR DEVICE AND ITS MANUFACTURE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate adaptable to multi-pin design by forming a connection terminal for connecting by flip chip connection at high density and provide a highly reliable semiconductor device. SOLUTION: In a board for a semiconductor device whereon a semiconductor chip is mounted by flip chip connection, a protruding part 14 which protrudes from a substrate surface like a cone corresponding to an electrode position of the semiconductor chip is provided to a silicon substrate 10, an SiO2 film 16 is formed on a surface of the silicon substrate 10 including the protruding part 14, and a bump 20 coated with a conductor layer 18 on the SiO2 film 16 of the protruding part 14 and a wiring pattern 22 formed of the conductor layer 18 and electrically connected to the conductor layer 18 of the bump 20 are provided.