| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the connection reliability and productivity by making larger resin fillets at the four corners of a semiconductor chip than those at its periphery, to reduce the warp of a substrate and relax the stress concentrated on bump connections at the corners of the chip. SOLUTION: Resin fillets at the four corners of a semiconductor chip 1 mounted as a flip chip on a substrate 2 are made larger than those at its periphery. A sealing resin 5 is flowed into a gap between the chip 1 and the substrate 2 from the four corners of the chip 1 mounted thereon. Au ball bumps 3 e.g. on electrode pads of the semiconductor chip 1 are connected to mounting pads 4 formed on a glass epoxy substrate 2 through an Ag-Sn solder. Then, a one- part type epoxy resin 5 is potted near the four corners of the chip 1 so that resin fillets at the four corners of the chip 1 are larger than those at the four sides thereof.</p> |
