| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain the subject adhesive soluble in an alkali aqueous solution, containing a specific resin and a specific plasticizer, excellent in surface smoothness, adhesive force, cleaning property, softening property and environmental suitability, capable of lowering a metal ion content and useful in semiconductor device field, etc. SOLUTION: This adhesive is soluble in an alkali aqueous solution and contains (A) 100 pts.wt. of a resin consisting essentially of a novolak type epoxy resin (A1 ) to which an acid anhydride is added or, as necessary, a resin consisting essentially of the component A1 and a rosin-based resin and (B) 3-35 pts.wt. plasticizer such as toluene sulfonic acid ethylamide, a phthalic acid ester-based compound, an oxyacid ester-based compound or an aliphatic dibasic ester-based compound.</p> |
