发明名称 Condensed single block PLA plus PAL architecture
摘要 A condensed single block PAL plus PLA architecture utilizing a rectangular shape is shown. By interleaving the ORterms of the PLA array with the Pterms of the PAL array, a significant amount of die space is saved when incorporating the circuit with silicon. The decode routing required is now simplified and the propagation delay skews through the array are also reduced.
申请公布号 US5684413(A) 申请公布日期 1997.11.04
申请号 US19960623622 申请日期 1996.03.28
申请人 PHILIPS ELECTRONICS NORTH AMERICA CORP. 发明人 SHIMANEK, SCHUYLER E.;DAVIES, THOMAS J.
分类号 H03K19/177;(IPC1-7):H03K19/177 主分类号 H03K19/177
代理机构 代理人
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