发明名称 |
Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom |
摘要 |
A package for a semiconductor die having a plurality of bonding pads about its periphery is provided. The package has a plastic molding encapsulating the semiconductor die. The package also has a plurality of conductive leads with leads having inner and outer portions, the inner portions encapsulated in the molding and arranged substantially in a plane and radially about the semiconductor die with ends displaced from and forming a rectangle with four corners about the die. A bonding wire extends from each of the bonding pads to one of the inner portions of the leads. Bonding wire loop heights of approximately 8 mils are made with a specially designed tip of a capillary tool. The package also has a pair of leads with inner portions at opposite corners of the rectangle, each of the inner portions connected to a pair of bonding wires from a pair of contiguous bonding pads on the die. This double wiring arrangement prevents wire sweep during the injection molding step. Bonding pad pitches of 4 mils or less on the semiconductor die are possible.
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申请公布号 |
US5684332(A) |
申请公布日期 |
1997.11.04 |
申请号 |
US19950579093 |
申请日期 |
1995.12.20 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHEN, C. M.;CHUNG, JAMES;LIN, K. T.;MAA, PONY;LI, SIMON |
分类号 |
H01L21/56;H01L23/495;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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