| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which enables effective prevention of irregularity in thickness and disconnection of a thin film wiring conductor and thus enables sufficient exhibition of desired characteristics. SOLUTION: In this multilayer wiring board, organic resin insulating layers 2 and thin film wiring conductors 3 are alternately stacked on an insulating board 1, and the upper and lower thin film wiring conductors 3 are connected with each other via a through-hole conductor 6 applied on the inner wall of a through-hole 5 provided in each organic resin insulating layer 2. A filler 7 having an upper surface substantially equal to the upper surface of each organic resin insulating layer 2 is filled within the through-hole 5 of each organic resin insulating layer 2. |
