发明名称 Integral thru-hole contacts
摘要 An integral thru-hole contact is provided for solderless connection of a pin inserted therein. The integral contact provides for an interconnect board of extremely low profile for interconnection with an IC package or sockets or pin grid array sockets and may provide for power/ground decoupling or voltage conversion and upgrading of microprocessors.
申请公布号 US5683256(A) 申请公布日期 1997.11.04
申请号 US19940353122 申请日期 1994.12.09
申请人 METHODE ELECTRONICS, INC. 发明人 WERTHER, WILLIAM E.
分类号 H01R13/66;H05K3/30;H05K3/32;H05K3/40;H05K7/10;(IPC1-7):H01R9/09 主分类号 H01R13/66
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