发明名称 |
Semiconductor chip package using improved tape mounting |
摘要 |
An LOC type semiconductor package and a fabricating method thereof comprises first and second through holes formed at inner leads and bus bars of the LOC-type lead frame, and third through holes formed at the tape which is bonded with the lower side of the inner leads and the bus bars, by pins at a tape cutter. Thus, air existing at both tape during the bonding process effectively flows out so as to prevent the trapping of air bubbles. Accordingly, during the wire bonding process, wire shorting and damage to the package body can be prevented. Since EMC is deposited into the first and the second through holes and supports the inner leads and the bus bars during the molding of the semiconductor package, the reliability of the semiconductor package can be improved.
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申请公布号 |
US5684328(A) |
申请公布日期 |
1997.11.04 |
申请号 |
US19960684989 |
申请日期 |
1996.07.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JIN, HO TAE;HONG, IN PYO;KO, CHANG EUI |
分类号 |
H01L23/50;H01L21/52;H01L23/495;(IPC1-7):H01L23/495;H01L23/52 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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