发明名称 PRINTED CIRCUIT BOARD WARMING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To enable the soldering of a defective of a printed circuit board while being warmed. SOLUTION: The control unit 15 comprises a working table 1 for mounting a printed board 2, a warm air nozzle 5 disposed above this table 1, a warm air unit 12 for always pneumatically feeding a warm air to the nozzle 5, an actuation cylinder 4 for moving the nozzle 5 to the table 1 and holding it in place, an actuating feeder 14 for feeding an actuating pressure to the cylinder 14 to control the pressure fed from the feeder 14. A control unit 15 actuates the cylinder 4 to move and hold the nozzle 5 in place, thereby warming the printed board 2 on the table 1.</p>
申请公布号 JPH09283902(A) 申请公布日期 1997.10.31
申请号 JP19960086986 申请日期 1996.04.10
申请人 OTIS ELEVATOR CO 发明人 UCHIDA MITSUYA;HACHITSUKA SEIICHI
分类号 H05B3/00;B29C65/10;B29C65/60;H05K3/22;H05K3/34;(IPC1-7):H05K3/34 主分类号 H05B3/00
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