| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an image forming device, wiring board and a method of manufacturing these device and board capable of easily repairing a short defect by current carrying repair, even when the short defect is generated in a crossing part of wiring, and capable of performing manufacture in good yield rate by reducing a cost without increasing a number of processes. SOLUTION: In this device, a plurality of electron emitting elements comprising an electron emitting part 005 and a pair of element electrodes 002, 003 are arranged in a matrix shape, in order to drive the concerned electron emitting element, an element substrate 001, formed by insulating a plurality of X, Y directional wirings (lower/upper wiring) 72, 73 formed of a thick film connected to element electrodes 002, 003 by an interlayer insulating layer 76 in a crossing part of the wirings, is used. Here, at least one of the X, Y directional wirings 72, 73 is divided into a plurality in the crossing part.</p> |
