发明名称 DIE BONDER
摘要 PROBLEM TO BE SOLVED: To enable the use change between a non-mapping system and mapping system with a low-cost modification. SOLUTION: A movable table 2, a mounting head 4 and a camera 3 are combined with an image recognizing system 13 which processes signals from the camera 3 for image recognition to judge if a chip 1 is good, and certify its position and controls the table 2 and head 4 to process many chips and position only the good chips and picks them up. Besides the above functions the system 13 has functions of requesting the outside for the position coordinates of a chip 1 to be next picked up on mapping data of a previously formed chip 1 through a communication interface 12, controlling the table according to the obtained data to move the chip 1 to a picking up position, processing signals from the camera 3 for image recognition to certify the position of the chip 1, controlling the table 2 and head 4 to position it and picking up it.
申请公布号 JPH09283541(A) 申请公布日期 1997.10.31
申请号 JP19960088485 申请日期 1996.04.10
申请人 NICHIDEN MACH LTD 发明人 HONDA MOTOHARU
分类号 H01L21/66;H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/66
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